Teknisk specifikationer Contact resistance≤ 3 mΩ (inner) (XLR) Contact resistance≤ 6 mΩ (outer) Dielectric strength1.5 kV dc / > 1 kVdc (XLR/Jack) Insulation resistance> 2 GΩ Locking device Latch lock Contact plating2 µm Ag ContactsBronze (CuBe2) (jack) InsertPolyamide (PA 6.6 30 % GR) ShellZinc diecast (ZnAl4Cu1) Shell platinggal Cu/NiEnvironmental Temperature range-20 °C to +65 °C
